We do standard and custom wafer
processing/metallization of high power semiconductor diode lasers in our
state of the art photolithography and metallization facility.
Laser
Refurbishing - We
refurbish other laser manufacturers' product such as
Spectra-Physics fiber coupled laser arrays. Contact us
for price and delivery.
Lapping - our lapping
facility has two Logitech top of the line semi automatic
semiconductor GaAs/AlAs and GaAs/InP lapping systems.
Photolithography - Our
photolithography facility includes a Karl Suss, MJB-3 high
performance contact semiconductor Mask Aligner which has a
.5um submicron resolution and can process up to 3"
wafers.
Processing
- In our state of the art facility we use Mr. Tihanyi's
barrier layer design system for metallization.
E-Beam - Two E-beam deposition
systems with 4 pocket E-guns each specially fitted and calibrated for
semiconductor laser processing.
AC/DC
Sputter - Our
Perkin Elmer 2400, 8 " target system has a large capacity for
large scale semiconductor laser processing and custom
processing.
Packaging - Mr. Tihanyi
is the inventor of flux free processing technology. Using
this technology he has designed a flux free soldering system
with the capability of soldering one to 20 lasers
simultaneously.
The facility uses the latest Loomis scribing/cleaving system
for bar and chip scribing and braking. The high resolution
pick and placement station is capable of placing a laser chip with
+_2um accuracy.
We have a dedicated vacuum deposition system to deposit In or
other material for laser
soldering preparation.
Several K&S systems are dedicated to wire bonding lasers.
A Polaris package/sealing system is used to hermetically seal
laser packages.
Testing/Life
Testing - Several laser life test and characterization systems
including a ILX, LPA-9084 ensure quality testing.
E-Beam - Two E-beam deposition
systems with 4 pocket E-guns each specially fitted and calibrated for
semiconductor laser processing.
