IN HOUSE CAPABILITIES

We do standard and custom wafer processing/metallization of high power semiconductor diode lasers in our state of the art photolithography and metallization facility.

Lapping - our lapping facility has two Logitech top of the line semi automatic semiconductor GaAs/AlAs and GaAs/InP lapping system. Photolithography - Our photolithography facility includes a Karl Suss, MJB-3 high performance contact semiconductor Mask Aligner which has a .5um submicron resolution and is capable to take up to 3" wafers. Processing - In our state of the art facility we use Mr. Tihanyi's barrier layer design system for metallization.   E-Beam - The two E-beam equipment with 4 pocket E-gun each specially fitted and calibrated for semiconductor laser processing.   AC/DC Sputter - Our Perkin Elmer 2400, 8 " target system has a large capacity for large scale semiconductor laser processing and custom processing. Packaging - Mr. Tihanyi is the inventor of the flux free processing technology. Using this technology he has designed a flux free soldering system with the capability of solder one to 20 lasers simultaneously. The facility uses the latest Loomis scribing/cleaving system for bar and chip scribing and braking. The high resolution pick and placement station is capable of placing a laser chip with +_2um accuracy. We have a dedicated vacuum deposition system to deposit In or other material for laser soldering preparation. Several K&S systems are dedicated to wire bonding lasers. A Polaris package/sealing system is used for hermetic sealing laser packages. Testing/Life Testing - Several laser life test and characterization system including a ILX, LPA-9084 insure our quality testing. SEM Analysis

E-Beam   Sputtering   Mask Aligner

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CONSULTATION SERVICES

Technology Transfer Laser Design Laser Processing High Power Laser Chip and Bar Packaging Scribing - Cleaving Wire Bonding Chip and Wafer Soldering Packaging SEM Analysis	Scribing
	Soldering

PLT TECHNOLOGY

Phone:  805.962.1266
Fax: 805.962.1713